METHOD OF CREATING A COOLANT CHANNEL IN A SEMICONDUCTOR WAFER ASSEMBLY

A wafer assembly with internal fluid channels. The assembly is fabricated by creating one or more channels in a first surface of a first semiconductor wafer and creating an oxide surface on the first surface of the first semiconductor wafer. An oxide surface is also created on a first surface of a s...

Full description

Saved in:
Bibliographic Details
Main Authors WONG, Tse E, MILNE, Jason G, KOONTZ, Christopher R
Format Patent
LanguageEnglish
French
German
Published 03.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A wafer assembly with internal fluid channels. The assembly is fabricated by creating one or more channels in a first surface of a first semiconductor wafer and creating an oxide surface on the first surface of the first semiconductor wafer. An oxide surface is also created on a first surface of a second semiconductor wafer. The assembly is fabricated by bonding the oxide surface of the first surface of the first semiconductor wafer to the oxide surface of the first surface of the second semiconductor wafer to create a wafer assembly and to seal the one or more channels at edges defined by the bonded first and second surfaces.
Bibliography:Application Number: EP20130821743