PLATING METHOD

Copper electroplating baths having a surface tension of ‰¤ 40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

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Bibliographic Details
Main Authors THORSETH, MATTHEW A, GOMEZ, LUIS A, SCALISI, MARK A, HAZEBROUCK, REBECCA LEA, LIEB, BRYAN, LEFEBVRE, MARK
Format Patent
LanguageEnglish
French
German
Published 06.01.2016
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Copper electroplating baths having a surface tension of ‰¤ 40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.
Bibliography:Application Number: EP20150173908