Method of inhibiting copper deposition on hair

Use of a shampoo composition comprising from 0.025% to 0.25% histidine, by weight of the shampoo composition, from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition, and from 20% to 95% of an aqueous carrier, by weight of the shampoo composition for inhibiting copp...

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Bibliographic Details
Main Authors Kelly, Casey Patrick, Marsh, Jennifer Mary
Format Patent
LanguageEnglish
French
German
Published 22.05.2019
Subjects
HUMAN NECESSITIES
HYGIENE
MEDICAL OR VETERINARY SCIENCE
PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES
SPECIFIC USE OF COSMETICS OR SIMILAR TOILETPREPARATIONS
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Summary:Use of a shampoo composition comprising from 0.025% to 0.25% histidine, by weight of the shampoo composition, from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition, and from 20% to 95% of an aqueous carrier, by weight of the shampoo composition for inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair.
Bibliography:Application Number: EP20140165920