IMPRINT MOLD MANUFACTURING METHOD, IMPRINT MOLD, AND IMPRINT MOLD MANUFACTURING KIT

• Main Authors: SAKATA, IKUMI, MISAWA, TAKEHIDE
• Format: Patent
• Language: English; French; German
• Published: 30.09.2015
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method for manufacturing an imprint mold which can prevent accumulation of the transferring resin at the joining portion of the film mold is provided. According to the present invention, a method for manufacturing an imprint mold, including: a winding step to wind a resin film mold onto a cylindrical transferring roll, the resin film mold being provided with a reverse pattern of a desired fine concave-convex pattern and the resin film mold being wound onto the transferring roll so that a gap without the reverse pattern is provided at a butting portion of both ends of the resin film mold; a resin filling step to fill a resin composition into the gap; and a pattern forming step to form a pattern substantially the same as the reverse pattern onto the resin composition, is provided.