Heat spreader in multilayer build ups

Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a", 4b', 4b") and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distri...

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Bibliographic Details
Main Authors KREUTZWIESNER, ELISABETH, SCHULZ, GERNOT
Format Patent
LanguageEnglish
French
German
Published 02.09.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Connection system (1) for electronic components, the connection system (1) comprising at least one electrically insulating layer (4a', 4a", 4b', 4b") and at least one electrically conductive layer (3a, 6a, 3b, 6b), wherein the connection system (1) further comprises a heat distributing layer (5a, 5b) arranged within the at least one electrically insulating layer (4a', 4a", 4b', 4b"), wherein the at least one heat distributing layer (5a, 5b) is made of thermally conductive, and electrically insulating, matrix-free material.
Bibliography:Application Number: EP20140157255