MOULDING METHOD FOR PRODUCING AN ELECTRONIC HOUSING

The method involves supplying a set of conductive metallizations including beaches and/or circuit conducting tracks on a side of a support (5). A chip (2) is connected to each of the set of metallizations. The chip is molded on the support with an insulating molding material (7) to build a case. The...

Full description

Saved in:
Bibliographic Details
Main Authors AUDOUARD, LAURENT, GUIJARRO, SÉBASTIEN, DOSSETTO, LUCILE, OTTOBON, STÉPHANE
Format Patent
LanguageEnglish
French
German
Published 29.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The method involves supplying a set of conductive metallizations including beaches and/or circuit conducting tracks on a side of a support (5). A chip (2) is connected to each of the set of metallizations. The chip is molded on the support with an insulating molding material (7) to build a case. The case is separated from the support. A side of the support is arranged in contact with the metallizations comprising adhesive that is liable to deteriorate, where molding of the chip is carried out according to final dimension of an electronic package (1) such as smart card module. An independent claim is also included for a molding equipment.
Bibliography:Application Number: EP20130762853