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Summary:The present invention is related to a polyamide resin, comprising a main structural unit derived from at least one dimeric C10-30 carboxylic acid and at least one polyamine, preferably selected from the group consisting of diamines and triamines, and at least one polyorganosiloxane moiety covalently linked to said at least one main structural unit. The present invention is furthermore related to a process for preparing said polyamide resin, to a release lacquer comprising said polyamide resin, and to a film, comprising said release lacquer on its one surface and a layer of a pressure-sensitive adhesive on its other surface.
Bibliography:Application Number: EP20130198697