LED MODULE

The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The...

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Main Authors NAKAMURA, AKIFUMI, URANO, YOJI, IMAI, RYOJI, HIRANO, TORU, HYUGA, HIDEAKI, GODA, JUN, IOKA, HAYATO, SUZUKI, MASANORI
Format Patent
LanguageEnglish
French
German
Published 08.04.2015
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Summary:The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
Bibliography:Application Number: EP20130796411