LASER ABLATION PROCESS FOR MANUFACTURING SUBMOUNTS FOR LASER DIODE AND LASER DIODE UNITS
A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
27.01.2016
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Subjects | |
Online Access | Get full text |
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Summary: | A method for manufacturing submounts for laser diodes includes the steps of providing a base configured with a ceramic carrier and a metal layer deposited upon the substrate. The method further includes using a pulsed laser operative to generate a plurality of pulses which are selectively trained at predetermined pattern on the metal layer's surface so as to ablate the desired regions of the metal layer to the desired depth. Thereafter the base is divided into a plurality of submounts each supporting a laser diode. The metal layer includes a silver sub-layer deposited upon the ceramic and having a thickness sufficient to effectively facilitate heat dissipation. |
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Bibliography: | Application Number: EP20130832210 |