Light emitting device

According to an embodiment, a light emitting device (110, 110a, 110b, 110c, 110d) includes a heat radiation plate (51), a semiconductor light emitting element (20), a mounting substrate section (15) including a ceramic substrate (10), and first and second metal layers (11,12), and a bonding layer (5...

Full description

Saved in:
Bibliographic Details
Main Authors MATSUMOTO, KATSUHISA, SASAKI, AKIHIRO, BETSUDA, NOBUHIKO
Format Patent
LanguageEnglish
French
German
Published 06.05.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:According to an embodiment, a light emitting device (110, 110a, 110b, 110c, 110d) includes a heat radiation plate (51), a semiconductor light emitting element (20), a mounting substrate section (15) including a ceramic substrate (10), and first and second metal layers (11,12), and a bonding layer (52). The ceramic substrate (10) is provided between the heat radiation plate (51) and the semiconductor light emitting element (20). The mounting substrate section (15) contacts the ceramic substrate (10) between the heat radiation plate (51) and the ceramic substrate (10), and includes a first surface (12b) on a side of the heat radiation plate (51) and a side surface (12c) intersecting a plane perpendicular to a direction from the heat radiation plate (51) to the semiconductor light emitting element (20). The bonding layer (52) is provided between the heat radiation plate (51) and the second metal layer (12), and bonds the heat radiation plate (51) and the second metal layer (12) so as to cover the first surface (12b) and to contact a part of the side surface (12b).
Bibliography:Application Number: EP20140156814