SUPERSPEED INTER-CHIP COMMUNICATIONS

An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY int...

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Bibliographic Details
Main Authors SARWAR, Zeeshan, SHARMA, Shalini, CHELLAPAN, Satheesh, MUKKER, Anoop, RANGANATHAN, Sridharan, HARRIMAN, David J, VADIVELU, Karthi R
Format Patent
LanguageEnglish
French
German
Published 04.02.2015
Subjects
CALCULATING
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION ANDCOMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION ANDCOMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THIR OWNENERGY USE
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
PHYSICS
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Summary:An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
Bibliography:Application Number: EP20130769253