CHIP CARD AND MANUFACTURING METHOD
The card has a body (15) and an electronic module (1) that is placed within a recess (17) of the body. A colored layer (13) is placed between the electronic module and the bottom of the recess of the card body. The colored layer is provided identical to a color of the card body. The electronic modul...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English French German |
Published |
19.10.2016
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The card has a body (15) and an electronic module (1) that is placed within a recess (17) of the body. A colored layer (13) is placed between the electronic module and the bottom of the recess of the card body. The colored layer is provided identical to a color of the card body. The electronic module comprises a protection resin (8) and the colored layer is carried by the protection resin. The colored layer is carried by the bottom of the recess of the card body. The colored layer is carried out by ink impression. An independent claim is also included for a method for manufacturing a smart card. |
---|---|
Bibliography: | Application Number: EP20130711052 |