CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS

A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversio...

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Bibliographic Details
Main Authors HUANG, DAWEI, MCELFRESH, DAVID K, RAJ, KANNAN, ANESHANSLEY, NICHOLAS E, SZE, THERESA
Format Patent
LanguageEnglish
French
German
Published 07.01.2015
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).
Bibliography:Application Number: EP20130711491