Circuit board comprising spatial light modulator

An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is position...

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Bibliographic Details
Main Authors SHEN, KELEI, HUONKER, MICHAEL, KRAFT, GÜNTHER, NOSHADI, VALDO, OBERST, WIELAND
Format Patent
LanguageEnglish
French
German
Published 24.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer. The electronic component further comprises a Peltier heater/cooler device, comprising a first heater/cooler surface, at least one pair of thermoelectric members and a second heater/cooler surface. The first heater/cooler surface, the thermoelectric members and the second heater/cooler surface are coplanar and are at least partially embedded between layers of the circuit board. The Peltier heater/cooler device is in thermal contact with the spatial light modulator device.
Bibliography:Application Number: EP20130156006