COOLING DEVICE FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE

• Main Authors: ICHIMURA, Takeshi, MOROZUMI, Akira, GOHARA, Hiromichi
• Format: Patent
• Language: English; French; German
• Published: 26.02.2020
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Provided is a cooling device for a semiconductor module that eliminates the increase in temperature occurring only at some of semiconductor elements and enables uniform and stable cooling of semiconductor elements. The cooling device for a semiconductor module supplies a coolant from the outside into a water jacket (2A) and cools semiconductor elements disposed on an outer surface thereof. An introducing port (24) and a discharge port (25) are disposed at a left wall (2Ab) of the water jacket (2A), and an introducing port section (21a) and a discharge port section (22a) protrude from the same left wall (2Ab). A flow velocity adjusting plate (28) is disposed parallel to fins (2C) in a coolant discharge flow channel (22) serving as the second flow channel disposed parallel to and at a distance from a coolant introducing flow channel (21) serving as the first flow channel. The adjustment of flow velocity distribution in the fins (2C) can be performed by using the pressure generated when the coolant collides with the flow velocity adjusting plate (28).