INTEGRATED MICRONEEDLE ARRAY DELIVERY SYSTEM
The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
02.12.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device. |
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Bibliography: | Application Number: EP20120840675 |