LAYER ASSEMBLY FOR HEAT EXCHANGER

There is disclosed herein a layer assembly for a heat exchanger, the layer assembly comprising: at least one heat pump module, the module comprising a thermo-electric cooler (TEC) attached to an island formed from a flow-permissive material; a flow-permissive layer provided with an island-reciprocat...

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Bibliographic Details
Main Authors CHANDLER, Nicholas, HARPER, Richard John
Format Patent
LanguageEnglish
French
German
Published 07.11.2018
Subjects
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Summary:There is disclosed herein a layer assembly for a heat exchanger, the layer assembly comprising: at least one heat pump module, the module comprising a thermo-electric cooler (TEC) attached to an island formed from a flow-permissive material; a flow-permissive layer provided with an island-reciprocating recess for substantially corresponding to and accommodating the island; a thermal storage layer comprising a heat transfer matrix material charged with a phase-change material, and provided with a TEC-reciprocating recess for substantially corresponding to and accommodating the TEC, wherein the TEC is attached to the thermal storage layer at a surface of the TEC-reciprocating recess, and the flow-permissive layer and the thermal storage layer are arranged such that the island of flow-permissive material extends into the island-reciprocating recess and a separation exists between the island and the flow-permissive layer.
Bibliography:Application Number: EP20120769153