MULTILAYER FILMS FOR RECLOSABLE PACKAGING

Disclosed is a multilayer structure that comprises a heat sealable layer comprising amorphous polyethylene terephthalate with a melting point greater than 200° C., a pressure sensitive adhesive and at least one tie layer encapsulating the pressure sensitive adhesive. The structure can be coextruded...

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Bibliographic Details
Main Authors ROULIN, Jacques, TROUILHET, Yves M
Format Patent
LanguageEnglish
French
German
Published 24.03.2021
Subjects
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Summary:Disclosed is a multilayer structure that comprises a heat sealable layer comprising amorphous polyethylene terephthalate with a melting point greater than 200° C., a pressure sensitive adhesive and at least one tie layer encapsulating the pressure sensitive adhesive. The structure can be coextruded without degrading the pressure sensitive adhesive. Also disclosed is a reclosable package comprising the structure and methods to make such structures.
Bibliography:Application Number: EP20120724058