MULTILAYER FILMS FOR RECLOSABLE PACKAGING
Disclosed is a multilayer structure that comprises a heat sealable layer comprising amorphous polyethylene terephthalate with a melting point greater than 200° C., a pressure sensitive adhesive and at least one tie layer encapsulating the pressure sensitive adhesive. The structure can be coextruded...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
24.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Disclosed is a multilayer structure that comprises a heat sealable layer comprising amorphous polyethylene terephthalate with a melting point greater than 200° C., a pressure sensitive adhesive and at least one tie layer encapsulating the pressure sensitive adhesive. The structure can be coextruded without degrading the pressure sensitive adhesive. Also disclosed is a reclosable package comprising the structure and methods to make such structures. |
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Bibliography: | Application Number: EP20120724058 |