Semiconductor module
According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors disposed between the first and second electrical conductors, a first power terminal (46a), a second power terminal (46b), a signal terminal (50),...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
21.10.2015
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Subjects | |
Online Access | Get full text |
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Summary: | According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors disposed between the first and second electrical conductors, a first power terminal (46a), a second power terminal (46b), a signal terminal (50), and a block-shaped insulator (52) which covers the components. The insulator includes a flat bottom surface in which the first and second electrical conductors are exposed, a flat first lateral surface (52a), a second lateral surface (52b), a ceiling surface (52d), a first end surface (52e), and a second end surface. The first power terminal, the second power terminal, and the signal terminal extending outwardly from the first end surface, the second end surface, and the ceiling surface, respectively. The first end surface, the ceiling surface, and the second end surface of the insulator being formed with a parting line (54). |
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Bibliography: | Application Number: EP20130183667 |