INK FOR DIRECT PLATEMAKING OF NANOMETER MATERIAL PRINTING AND METHOD FOR PREPARING SAME
An ink used for direct platemaking techniques for nanometer material printing and a method for preparing same. Of the baseline total amount of the ink, 5 to 30 wt% is of film-forming resin, 0.01 to 5 wt% is of nanometer or micrometer dye, 30 to 60 wt% is of organic solvent, 0.01 to 5 wt% is of humec...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
12.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | An ink used for direct platemaking techniques for nanometer material printing and a method for preparing same. Of the baseline total amount of the ink, 5 to 30 wt% is of film-forming resin, 0.01 to 5 wt% is of nanometer or micrometer dye, 30 to 60 wt% is of organic solvent, 0.01 to 5 wt% is of humectant, and water provides the balance; these ingredients are stirred and mixed at room temperature, and after the film-forming resin is completely dissolved, impurities and/or insoluble substances in the present invention are removed by means of multi-level filtering, and the obtained filtrate is the present ink. The ink in the present invention is sprayed on a metal base material surface by an inkjet printer o form a printing pattern which, after curing, can be directly printed on the machine, thus reducing chemical pollution and post-processing processes, while a press run of the printing plate can be up to 100,000 copies at a resolution of up to 175 lpi. |
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Bibliography: | Application Number: EP20120792281 |