HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES

A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

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Bibliographic Details
Main Authors MØLLER, Henrik B, STYHM, Ove, ANDERSEN, Thomas Lundgren, ABEYASEKERA, Tusitha
Format Patent
LanguageEnglish
French
German
Published 11.04.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.
Bibliography:Application Number: EP20120732961