Electrically conductive bonding material and method of bonding with the same

• Main Authors: IDE, EIICHI, MORITA, TOSHIAKI, INADA, TEIICHI, YASUDA, YUUSUKE
• Format: Patent
• Language: English; French; German
• Published: 23.04.2014
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CASTING; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING METALLIC POWDER

According to the present invention an electrically conductive bonding material comprises silver particles (202), silver oxides particles (203), a dispersant comprising an organic material containing not more than 30 carbon atoms, and an organic solvent having a boiling point of not higher than 350°C as essential components. The total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is 100 mass parts and an amount of the organic solvent is not more than 90 mass parts. The silver particles (202) are in flake form; and the total amount of the silver particles (202), the silver oxide particles (203), the dispersant, and the organic solvent is in a range of 99.0% to 100% by weight.