METHOD OF TRANSFERRING THIN FILMS

The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact...

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Bibliographic Details
Main Authors HO, Peter, WONG, Loke-Yuen, ZHUO, Jing-Mei, LIM, Geok-Kieng, SONG, Jie, LOH, Kian, Ping, KAM, Fong, Yu, CHUA, Lay-Lay, PNG, Rui-Qi
Format Patent
LanguageEnglish
French
German
Published 07.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
Bibliography:Application Number: EP20120788925