NOVEL COMPOUND, COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT

The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):

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Bibliographic Details
Main Authors TANABE, Yoshimitsu, INAMI, Chidzuru, KOHGO, Osamu, UEKI, Hideyuki, NARUSE, Hiroshi, MIYASATO, Masataka, MIYATA, Shunsuke
Format Patent
LanguageEnglish
French
German
Published 05.02.2020
Subjects
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Summary:The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
Bibliography:Application Number: EP20120785801