NOVEL COMPOUND, COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT
The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1):
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Main Authors | , , , , , , |
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Format | Patent |
Language | English French German |
Published |
26.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a novel compound and a composition including the compound that exhibit small polymerization shrinkage particularly during curing and are producible at low cost on the industrial scale. The compound of the present invention is represented by Formula (1): |
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Bibliography: | Application Number: EP20120785801 |