COOLER FOR SEMICONDUCTOR MODULE

A semiconductor module and a cooler capable of effectively cooling a semiconductor device are provided. The semiconductor module supplies a coolant to a water jacket (2A) constituting the cooler from outside and cools a circuit element unit arranged on an outer surface of a fin base. The semiconduct...

Full description

Saved in:
Bibliographic Details
Main Authors ICHIMURA, Takeshi, MOROZUMI, Akira, GOHARA, Hiromichi
Format Patent
LanguageEnglish
French
German
Published 13.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor module and a cooler capable of effectively cooling a semiconductor device are provided. The semiconductor module supplies a coolant to a water jacket (2A) constituting the cooler from outside and cools a circuit element unit arranged on an outer surface of a fin base. The semiconductor module comprises fins (2C) thermally connected to the circuit element unit, and a coolant introduction flow channel (21) which is arranged in the water jacket (2A), which extends from a coolant inlet (24), and which includes a guide section (21Si) that is inclined so as to guide the coolant toward one side surface of the fins (2C). In type G, an inlet section (21a) that guides the coolant to the coolant introduction flow channel (21) is formed into a tapered cross-sectional shape, and the flow channel width thereof is varied so that a width (w2) at a starting end section of the coolant introduction flow channel (21) is narrower than a width (w1) of an outlet (25).
Bibliography:Application Number: EP20120776276