Method for manufacturing a silver alloy wire for bonding applications

• Main Authors: Tark, Yong-Deok, Ryu, Jae-Sung, Chung, Eun-Kyun
• Format: Patent
• Language: English; French; German
• Published: 22.03.2017
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

The invention is related to a bonding wire, comprising: a core with a surface, wherein the core comprises silver as a main component and at least one member selected from the group consisting of gold, palladium, platinum, rhodium, ruthenium, nickel, copper and iridium, characterized in that the bonding wire has at least one of the following properties: i) an average size of crystal grains of the core is between 0.8 µm and 3 µm, ii) the amount of crystal grains having an orientation in direction in the cross section of the wire is in the range of 10 €• 20 %, iii) the amount of crystal grains having an orientation in direction in the cross section of the wire is in the range of 5 €•15 %, and iv) the total amount of crystal grains having an orientation in direction and of crystal grains having an orientation in direction in the cross section of the wire is in the range of 15 €• 40 %.