Plating bath composition for immersion plating of gold

• Main Authors: Brunner, Dr. Heiko, Niemann, Sandra, Schulz, Jenny, Rückbrod, Sven, Kohlmann, Lars, Schafsteller, Britta Dr, Habig, Ellen
• Format: Patent
• Language: English; French; German
• Published: 02.10.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to a cyanide-free aqueous immersion-type plating bath for deposition of gold, comprising gold ions, at least one complexing agent, sulfite ions, thiosulfate ions, and at least one ureylene polymer additive. The gold layer deposited from the plating bath according to the present invention shows a lemon-yellow colour and a sufficient wettability for tin based solder materials.