Systems and methods for dissipating heat in an enclosure

An enclosure (102) is presented. The enclosure includes an outer casing (106) having one or more walls (122,124,126,128,130). Further, the enclosure includes a synthetic jet assembly (!34,204) configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracke...

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Bibliographic Details
Main Authors WHALEN, BRYAN PATRICK, GROSS JR., WILLIAM EARL, MEIER, ROBERT PAUL, DE BOCK, HENDRIK PIETER JACOBUS
Format Patent
LanguageEnglish
French
German
Published 05.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An enclosure (102) is presented. The enclosure includes an outer casing (106) having one or more walls (122,124,126,128,130). Further, the enclosure includes a synthetic jet assembly (!34,204) configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket (210) operatively coupled to the one or more walls of the outer casing and one or more synthetic jets (206) operatively coupled to the bracket.
Bibliography:Application Number: EP20130178631