PRESSURE UNIT

• Main Authors: KATO, NOBUHARU, MASUDA, MICHIYA, SASUGA, ICHIRO, TSURUGAI, KENGO, TAKAMURA, NORITOSHI
• Format: Patent
• Language: English; French; German
• Published: 22.01.2014
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; LIGHTING; MEANS FOR DAMPING VIBRATION; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; SHOCK-ABSORBERS; SPRINGS; THERMAL INSULATION IN GENERAL; WEAPONS

Provided is a pressure unit that is capable of absorbing dimensional variations of a pressing target at the time of manufacturing and is capable of being made thinner with a simple configuration. The pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconductor element module and a cooling tube that makes contact with the semiconductor element module and cools the semiconductor module. The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end portions of the spring member are attached.