PRESSURE UNIT
Provided is a pressure unit that is capable of absorbing dimensional variations of a pressing target at the time of manufacturing and is capable of being made thinner with a simple configuration. The pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconduc...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
22.01.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a pressure unit that is capable of absorbing dimensional variations of a pressing target at the time of manufacturing and is capable of being made thinner with a simple configuration. The pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconductor element module and a cooling tube that makes contact with the semiconductor element module and cools the semiconductor module. The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end portions of the spring member are attached. |
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Bibliography: | Application Number: EP20120758031 |