PRESSURE UNIT

Provided is a pressure unit that is capable of absorbing dimensional variations of a pressing target at the time of manufacturing and is capable of being made thinner with a simple configuration. The pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconduc...

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Bibliographic Details
Main Authors KATO, NOBUHARU, MASUDA, MICHIYA, SASUGA, ICHIRO, TSURUGAI, KENGO, TAKAMURA, NORITOSHI
Format Patent
LanguageEnglish
French
German
Published 22.01.2014
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ENGINEERING ELEMENTS AND UNITS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
LIGHTING
MEANS FOR DAMPING VIBRATION
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
SHOCK-ABSORBERS
SPRINGS
THERMAL INSULATION IN GENERAL
WEAPONS
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Summary:Provided is a pressure unit that is capable of absorbing dimensional variations of a pressing target at the time of manufacturing and is capable of being made thinner with a simple configuration. The pressure unit pressurizes a semiconductor stacked unit obtained by alternately stacking a semiconductor element module and a cooling tube that makes contact with the semiconductor element module and cools the semiconductor module. The pressure unit includes a spring member that is formed into a coil form obtained by winding a wire rod and that has a periodically changing pitch angle and a housing member to which end portions of the spring member are attached.
Bibliography:Application Number: EP20120758031