Methods to recover and purify silicon particles from saw kerf

The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolat...

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Bibliographic Details
Main Authors RAGAN, TRACY M, GRABBE, ALEXIS
Format Patent
LanguageEnglish
French
German
Published 01.01.2014
Subjects
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Summary:The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
Bibliography:Application Number: EP20130174613