Methods to recover and purify silicon particles from saw kerf
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolat...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
01.01.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material. |
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Bibliography: | Application Number: EP20130174613 |