RESIN COMPOSITION, PREPREG, AND METAL FOIL-CLAD LAMINATE

There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mountin...

Full description

Saved in:
Bibliographic Details
Main Authors TAKADA, Keisuke, MORISHITA, Koji, KOIZUMI, Kaoru
Format Patent
LanguageEnglish
French
German
Published 17.10.2018
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D).
Bibliography:Application Number: EP20120747364