SUBSTRATE WITH THOUGH ELECTRODE AND METHOD FOR PRODUCING SAME
A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each ot...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
04.12.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each other so that the protrusions 52 are inserted in the respective recesses 21 or through-holes 21B; and bonding the silicon substrate 51 and the glass substrate 54 to each other. |
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Bibliography: | Application Number: EP20120739563 |