SUBSTRATE WITH THOUGH ELECTRODE AND METHOD FOR PRODUCING SAME

A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each ot...

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Main Authors HOZUMI, JUNICHI, TOMOIDA, RYO, OKUMURA, SHIN, NAKATANI, TOMOHIRO, TAURA, TAKUMI
Format Patent
LanguageEnglish
French
German
Published 04.12.2013
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Summary:A method for producing a substrate with through-electrode includes the steps of: forming recesses 21 or through-holes 21B in either one of a silicon substrate 51 and a glass substrate 54; forming protrusions 52 in the other substrate; laying the silicon substrate 51 and glass substrate 54 on each other so that the protrusions 52 are inserted in the respective recesses 21 or through-holes 21B; and bonding the silicon substrate 51 and the glass substrate 54 to each other.
Bibliography:Application Number: EP20120739563