HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS

A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites.

Saved in:
Bibliographic Details
Main Authors WILSON, MARK B, HEARN, ROBERT L
Format Patent
LanguageEnglish
French
German
Published 08.04.2015
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites.
Bibliography:Application Number: EP20120702911