METHOD FOR PROVIDING ELECTRICAL CONNECTION(S) IN AN ENCAPSULATED ORGANIC LIGHT-EMITTING DIODE DEVICE, AND SUCH AN OLED DEVICE

A process for manufacturing an encapsulated OLED device, which includes, after encapsulation of the device, a step of ultrasonic soldering at a first edge of the lower electrode, forming a lower electrical connection zone with a solder pad extending from the encapsulation surface as far at least as...

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Bibliographic Details
Main Author TCHAKAROV, SVETOSLAV
Format Patent
LanguageEnglish
French
German
Published 07.08.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A process for manufacturing an encapsulated OLED device, which includes, after encapsulation of the device, a step of ultrasonic soldering at a first edge of the lower electrode, forming a lower electrical connection zone with a solder pad extending from the encapsulation surface as far at least as the surface of the lower electrode, and/or a step of ultrasonic soldering in an upper electrical connection zone with a solder pad extending from the encapsulation surface as far at least as the surface of the upper electrode.
Bibliography:Application Number: EP20110773752