Light emitting device and the method of manufacturing thereof

The present invention provides a molded package 10 for a light emitting device including a molded resin 11 and first lead 20 and second lead 30 spaced each other, wherein the exposed surface 21 of the first lead has a first and second edge portions 23, 25 opposed to each other so as to put a mountin...

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Bibliographic Details
Main Authors KASAE, Nobuhide, SEJIKI, Keisuke
Format Patent
LanguageEnglish
French
German
Published 22.05.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a molded package 10 for a light emitting device including a molded resin 11 and first lead 20 and second lead 30 spaced each other, wherein the exposed surface 21 of the first lead has a first and second edge portions 23, 25 opposed to each other so as to put a mounting area 60 therebetween in a first direction, the first and second edge portions 23, 25 respectively having one first cutout 24 second cutouts 26, and wherein the mounting area 60 has a size 60L not less than a distance 601L between the first cutout 24 and the second cutouts 26 and less than a distance 602L between the first edge portion 23 and the second edge portion 25 in the first direction.
Bibliography:Application Number: EP20120199636