Light emitting diode module

A method for manufacturing a electronic and/or optoelectronic module comprises the following steps: - mounting a electronic and/or optoelectronic chip on a board, - making on the board an outer ring made from a liquid resin, the outer ring surrounding the electronic and/or optoelectronic chip, - mak...

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Bibliographic Details
Main Authors Hoschopf, Hans, Schrank, Franz
Format Patent
LanguageEnglish
French
German
Published 25.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a electronic and/or optoelectronic module comprises the following steps: - mounting a electronic and/or optoelectronic chip on a board, - making on the board an outer ring made from a liquid resin, the outer ring surrounding the electronic and/or optoelectronic chip, - making a central filling of the volume defined by the outer ring, the central filling being made from a liquid resin and covering the top surface of the electronic and/or optoelectronic chip, - curing in one single step the resin of the outer ring and the central filling and making a chemically linked interface between the outer ring and the central filling.
Bibliography:Application Number: EP20120198155