STRUCTURE AND METHOD FOR MANUFACTURING INTERCONNECT STRUCTURES HAVING SELF-ALIGNED DIELECTRIC CAPS

• Main Authors: PONOTH, Shom, NOGAMI, Takeshi, YANG, Chih-Chao, HORAK, David, V
• Format: Patent
• Language: English; French; German
• Published: 27.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Interconnect structures having self-aligned dielectric caps are provided. At least one metallization level is formed on a substrate. A dielectric cap is selectively deposited on the metallization level.