HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION

• Main Authors: MATTES, Michael, F, SMITH, Jonathan, R, RUBEN, David, A
• Format: Patent
• Language: English; French; German
• Published: 27.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DIAGNOSIS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROTHERAPY; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; MAGNETOTHERAPY; MEDICAL OR VETERINARY SCIENCE; RADIATION THERAPY; SEMICONDUCTOR DEVICES; SURGERY; ULTRASOUND THERAPY

An implantable medical device (IMD) is disclosed. The IMD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device.