ULTRASOUND PROBE, PRODUCTION METHOD THEREFOR, AND ULTRASOUND DIAGNOSTIC EQUIPMENT

• Main Authors: SAKO,Akifumi, FUKADA,Makoto, ISHIDA,Kazunari
• Format: Patent
• Language: English; French; German
• Published: 31.05.2017
• Subjects: DEAF-AID SETS; DIAGNOSIS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MEDICAL OR VETERINARY SCIENCE; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; PERFORMING OPERATIONS; PUBLIC ADDRESS SYSTEMS; SURGERY; TRANSPORTING

Disclosed is an ultrasonic probe wherein the warpage of a CMUT due to thermal stress produced at the joint between a backing layer and the CMUT is minimized, thereby improving the durability of the bond between the CMUT and the backing layer. To accomplish this the ultrasonic probe is provided with: a CMUT (20) having vibratory elements that change the electromechanical coupling coefficient or sensitivity according to the bias voltage to be applied; a backing layer (22) adhered to the rear side of the ultrasonic transmission surface of the CMUT (20) ; and a thermal-stress balancing member (24) to be adhered to the backing layer (22) while being disposed facing the CMUT (20) in such a manner that the backing layer (22) is sandwiched therebetween so as to minimize the warpage of the CMUT (20) due to thermal stress produced between the CMUT (20).