METHOD FOR MEASURNG IN PATTERNED STRUCTURES

• Main Authors: BRILL, BOAZ, SHERMAN, BORIS
• Format: Patent
• Language: English; French; German
• Published: 25.11.2015
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CALCULATING; CINEMATOGRAPHY; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; TESTING

A method and system are provided for use in measurement of at least one parameter of a patterned structure. The method comprises: providing input data comprising: measured data including multiple measured signals corresponding to measurements on different sites of the structure; and data indicative of theoretical signals, a relation between the theoretical and measured signals being indicative of at least one parameter of the structure; providing a penalty function based on at least one selected global parameter characterizing at least one property of the structure; and performing a fitting procedure between the theoretical and measured signals, said performing of the fitting procedure comprising using said penalty function for determining an optimized relation between the theoretical and measured signals, and using the optimized relation to determine said at least one parameter of the structure.