MONITORING DEVICE FOR STEAM PHASE SOLDERING SYSTEM, STEAM PHASE SOLDERING SYSTEM WITH SUCH A DEVICE, METHOD OF MONITORING A STEAM PHASE SOLDERING SYSTEM

• Main Author: Zabel, Claus
• Format: Patent
• Language: English; French; German
• Published: 06.09.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PHYSICS; SOLDERING OR UNSOLDERING; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The monitoring device (235) for a vapor-phase soldering system (200), comprises a reference element (240), a measuring device (245) for measuring a temperature of the reference element, and a reception (250) to dispose the reference element in the vapor-phase soldering system, so that it section-wisely runs as a soldering product in a same process. The reference element is formed, so that it runs as the soldering product at the same temperature during it section-wisely runs as the soldering product in the same process. The reference element has a material composition and/or a structure. The monitoring device (235) for a vapor-phase soldering system (200), comprises a reference element (240), a measuring device (245) for measuring a temperature of the reference element, and a reception (250) to dispose the reference element in the vapor-phase soldering system, so that it section-wisely runs as a soldering product in a same process. The reference element is formed, so that it runs as the soldering product at the same temperature during it section-wisely runs as the soldering product in the same process. The reference element has a material composition and/or a structure, which correspond to a material composition and/or a structure of the soldering product. The reference element comprises an electrically insulating basic material of a printed circuit board, where the thermal conductivity of the reference element is tuneable to the thermal conductivity of the soldering material by a selection of a thickness of the basic material of the printed circuit board and/or by a suitable number of holes through the basic material of the printed circuit board. The electrically insulating basic material of the printed circuit board of the reference element comprises an electrically insulating basic material of a printed circuit board of the soldering material. The reception is formed to dispose the reference element at an equal level as the soldering product during heating process in the vapor-phase soldering system. The monitoring device has a cooling device for cooling the reference element, where the cooling element is designed to cool the reference element during unloading the soldering product and/or loading a new soldering product. The cooling device is designed to cool the temperature of the reference element at the temperature, which has the soldering product at the beginning of the heating process. The cooling device cools the reference element by introducing as liquid, which is evaporated for soldering. The cooling device takes the liquid to a filter circuit of the vapor-phase soldering system. The monitoring device has a device for automatically changing the reference element and a regulator, which is designed to regulate a heating and/or a cooling of the vapor-phase soldering system in dependent of the temperature measured with the measuring device. The monitoring device has a storage medium, which stores a predetermined temperature profile of a heating process of the soldering product, where the regulator is designed to regulate the temperature progression of the soldering product according to the stored temperature profile. An independent claim is included for a vapor-phase soldering system.