HEAT CONDUCTING MOUNTING STRUCTURE, METHOD AND RADIO BASE STATION HOUSING ARRANGEMENT FOR MOUNTING ELECTRONIC MODULES

• Main Authors: EKSTEDT, Ulf, JOHANSSON, Mikael
• Format: Patent
• Language: English; French; German
• Published: 14.06.2017
• Subjects: BOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLYOR DISTRIBUTION OF ELECTRIC POWER; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Heat conducting mounting structure for mounting of electronic modules, comprising first surface area that is adapted to face a second surface area of the electronic module; cavity means embedded at a distance from the first surface area; said cavity means is adapted to receive a cooling means; attachment means at the first surface area adapted for attaching the electronic module; and wherein the attachment means is adapted for a transfer of the heat energy from the electronic module to the mounting structure. Further a method for mounting the electronic module on the heat conducting mounting comprising the step of adjoining an attachment means with a fixing means and the fixing means with the electronic module to obtain at least one immediate connection pressure area between the first surface area of a wall and the second surface area of the electronic module. Also a radio base station housing arrangement is provided.