Copper nano paste, method for forming the copper nano paste, and method for forming electrode using the copper nano paste

Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts...

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Bibliographic Details
Main Authors KANG, SUNG KOO, JUN, BYUNG HO, OH, SUNG IL, KIM, DONG HOON, KIM, SEONG JIN, CHUN, BYOUNG JIN, SONG, YOUNG AH
Format Patent
LanguageEnglish
French
German
Published 19.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.
Bibliography:Application Number: EP20110275153