Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English French German |
Published |
28.03.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance. |
---|---|
Bibliography: | Application Number: EP20120151527 |