ALUMINIUM BASE DIE MATERIAL FOR STAMPER, ALUMINIUM BASE DIE FOR STAMPER, AND STAMPER

• Main Authors: SHIRAI, KOTA, ITO, HISAKAZU, KITA, HIROAKI
• Format: Patent
• Language: English; French; German
• Published: 18.07.2012
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; ALLOYS; APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; FERROUS OR NON-FERROUS ALLOYS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention relates to an aluminum die base material for a stamper having a component composition that contains 0. 5% by weight to 3.0% by weight of Mg, the total amount of elements other than Mg, including unavoidable impurities, is 500 ppm or less, and the remainder is composed of Al, and a forged structure in which the average crystal grain size is 1000 µ m or less and the surface area ratio of second phase particles is 0.10% or less. According to the present application, a stamper can be provided in which, together with the crystal grain size of the aluminum being refined, the formation of second phase particles is inhibited, surface irregularities attributable to mirrored surface polishing are reduced, and a uniform relief pattern is formed by anodic oxidation treatment.