Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

• Main Authors: YOKOCHI, TOMOHIRO, KAMIYA, TETSUAKI, KAMIYA, YASUTAKA, MASUDA, GENTARO, YAZAKI, YOSHITARO, KONDO, KOJI, HARADA, TOSHIKAZU, ONODA, RYUICHI
• Format: Patent
• Language: English; French; German
• Published: 20.06.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed...