Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

• Main Authors: YOKOCHI, TOMOHIRO, KAMIYA, TETSUAKI, KAMIYA, YASUTAKA, MASUDA, GENTARO, YAZAKI, YOSHITARO, KONDO, KOJI, HARADA, TOSHIKAZU, ONODA, RYUICHI
• Format: Patent
• Language: English; French; German
• Published: 20.06.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A manufacturing method of a multilayer substrate (101) is provided, comprising: laminating single-sided conductor patterned films (21, 21 a, 21 b), each of which has a resin film (23), a conductor pattern (22, 22a) formed only on a single side of the resin film, and a via hole (24, 24a, 24b) formed at a predetermined location and filled with an interlayer connection material (50); and adhering the single-sided conductor patterned films to each other to form a multilayer substrate; wherein an arbitrary two of single-sided conductor patterned films (21 a, 21 b) are laminated so that surfaces thereof on which the conductor patterns (22) are not formed face with each other, while remaining single-sided conductor patterned films (21) are laminated in such a manner that a surface on which the conductor pattern (22) is formed and a surface on which the conductor pattern (22) is not formed face with each other, whereby electrodes (32, 37) are formed by the conductive patterns (22) at both sides of the multilayer substrate (101).