MOLDING COMPOUND ON THE BASIS OF A COPOLYAMIDE CONTAINING TEREPHTHALIC ACID AND TRIMETHYLHEXAMETHYLENE DIAMINE UNITS

• Main Authors: PAWLIK, Andreas, ROOS, Martin, HÄGER, Harald, BAUMANN, Franz-Erich
• Format: Patent
• Language: English; French; German
• Published: 03.10.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBONFILAMENTS; CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS,THREADS, FIBRES, BRISTLES OR RIBBONS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; NATURAL OR ARTIFICIAL THREADS OR FIBRES; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SPINNING; TEXTILES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A molding compound, containing at least 30% by weight of a copolyamide, which is derived from the following monomers: a) 50 to 95 mole percent of the combination of a diamine, selected from the group consisting of 1,9-nonane diamine, 1,10-decane diamine, 1,11-undecane diamine and 1,12-dodecane diamine, and terephthalic acid, and b) 5 to 50 mole percent of the combination of a diamine, selected from the group consisting of 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, and mixtures thereof, and terephthalic acid. The copolyamide is crystalline and has low water absorption.